Microfluidic die with a high ratio of heater area to nozzle exit area
US9174445B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 20, 2014 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Jun 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49352
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure is directed to a microfluidic die having a substrate with an inlet path that is configured to move fluid into the die. The die includes a plurality of heaters formed above the substrate, each heater having a first area, a plurality of chambers formed above the plurality of heaters, and a plurality of nozzles formed above the chambers. Each nozzle having an entrance adjacent to the chamber and an exit adjacent to en external environment, the entrance having a second area, and the second having a third area, the first area being greater than the second area, and the second area being greater than the third area. A ratio of the first area to the third area being greater than 5 to 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.