Micromachined ultra-miniature piezoresistive pressure sensor and method of fabrication of the same
US9176018B2 · kind B2 · utility
5Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Feb 22, 2014 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Apr 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/47
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of fabrication of one or more ultra-miniature piezoresistive pressure sensors on silicon wafers is provided. The diaphragm of the piezoresistive pressure sensors is formed by fusion bonding. The piezoresistive pressure sensors can be formed by silicon deposition, photolithography and etching processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.