Probe and method of manufacture for semiconductor wafer characterization
US9176167B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2012 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Sep 29, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09G3/006
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A conductive probe for semiconductor material characterization includes a distal metallic layer of micrometer-size particles, an intermediate layer of conformable conductive elastomer material, and a pin attached to the elastomer layer. The probe is preferably manufactured by filling a recess in a bottom plate with the metallic particles, coupling a top plate thereto with a perforation aligned with the recess, and filling the perforation with uncured conductive elastomer. The pin, preferably spring-loaded, is pressed into the perforation to compress the silicone to its intended probe size. The silicone is then allowed to cure at room temperature or in a heated environment, or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.