Method of fabricating electronic circuit
US9177821B2 · kind B2 · utility
3Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2014 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Apr 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/623
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.