Housing for a semiconductor chip and semiconductor chip with a housing
US9177880B2 · kind B2 · utility
0Cited by
10References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2012 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Jul 26, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A housing for a semiconductor chip has an injection molded body, in which an accommodating area for accommodating the semiconductor chip is provided. The injection-molded body has at least one metallization for making electrical contact with the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.