Semiconductor device including contact pads
US9177891B2 · kind B2 · utility
9Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2013 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Oct 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/485
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a plurality of bit lines that intersect an active region on a substrate and extend in a first direction, a contact pad formed on the active region between adjacent bit lines, and a plurality of spacers disposed on sidewalls of the plurality of bit lines. An upper portion of the contact pad is interposed between adjacent spacers, and a lower portion of the contact pad has a width greater than a distance between adjacent spacers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.