Patent · US Active

Connection arrangement of an electric and/or electronic component

US9177934B2 · kind B2 · utility

0Cited by
2References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 25, 2013
Grant dateNov 3, 2015
Priority date
Expiry dateJan 25, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3512
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

The connection arrangement (100, 200, 300, 400) comprises at least one electric and/or electronic component (1). The at least one electric and/or electronic component (10) has at least one connection face (11), which is connected in a bonded manner to a join partner (40) by means of a connection layer (20). The connection layer (20) can for example be an adhesive, soldered, welded, sintered connection or another known connection that connects joining partners while forming a material connection. Furthermore, a reinforcement layer (30′) is arranged adjacent to the connection layer (20) in a bonded manner. The reinforcement layer (30′) has a higher modulus of elasticity than the connection layer (20). A particularly good protective effect is achieved if the reinforcement layer (30′) is formed in a frame-like manner by an outer and an inner boundary (36, 35) and, at least with the outer boundary (36) thereof, encloses the connection face (11) of the at least one electric and/or electronic component (10).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.