Semiconductor device, method of manufacturing the same, method of manufacturing display unit, and method of manufacturing electronic apparatus
US9177970B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 21, 2014 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Feb 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/451
Abstract
A semiconductor device includes: a gate electrode and a wiring; a first insulating film covering the gate electrode and the wiring; a semiconductor film opposed to the gate electrode with the first insulating film in between; a first concave section located in a position adjacent to the semiconductor film; a connection hole, the connection hole being provided in the first insulating film, and the connection hole reaching the wiring, and a first electrically-conductive film, the first electrically-conductive film being electrically connected to the wiring through the connection hole, and the first electrically-conductive film being buried in the first concave section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.