Patent · US Active

Deposition of patterned organic thin films

US9178184B2 · kind B2 · utility

8Cited by
30References
34Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 17, 2013
Grant dateNov 3, 2015
Priority date
Expiry dateJul 11, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/549
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Embodiments disclosed herein provide devices having a nozzle die with one or more nozzles, each of which has one or more integrated skimmers. The use of an integrated nozzle/skimmer structure allows for higher-resolution printing in OVJP-type deposition techniques without requiring the use of a shadow mask by allowing for a relatively narrow organic material beam that can be placed at relatively high distances away from the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.