Gold finger and touch screen
US9179547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2013 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Jan 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0376
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A gold finger, includes a substrate, an embossable adhesive layer and a plurality of wires. The gold finger is achieved through adhering an embossable adhesive layer to a side of the substrate, providing grid-shaped grooves on a side of the embossable adhesive layer away from the substrate, embedding conductive grids of the wires in the grooves to form the wires. The gold finger is disposed on a sensing component, the wires of the gold finger are electrically connected with a circuit board through an anisotropic conductive adhesive. The contact area of the wire and the embossable adhesive layer is increased through embedding the conductive grid of the wire, which is grid-shaped structure, in the grooves such that the wires are tightly combined to the embossable adhesive layer and not easy to fall off or be scratched. The present invention further provides a touch screen containing the gold finger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.