Method for manufacturing touch panel
US9179550B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2014 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Dec 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a touch panel includes the following procedures. A first conductive layer and a shielding layer surrounding the first conductive layer are formed on a base plate. The first conductive layer is etched to form a plurality of first and second sensing pads alternatively arranged according to columns. The first sensing pads in a column along a first direction are electrically coupled to each other to form a first sensing electrode column. The second sensing pads in a column along a second direction are electrically coupled to each other to form a second sensing electrode column. A second conductive layer is formed on the shielding layer via an ink jet printing method, and is etched to form a plurality of first and second sensing lines to be respectively electrically coupled to the first and second sensing electrode columns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.