Ultrasound transducer and method for manufacturing an ultrasound transducer
US9180490B2 · kind B2 · utility
9Cited by
1References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 22, 2012 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Jul 12, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements for electrically connecting the acoustic elements to the integrated circuit. The conductive elements are electrically connected to the integrated circuit. Solder is engaged between the acoustic elements and the conductive elements of the interposer such that the conductive elements of the interposer are electrically connected to the acoustic elements through the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.