Method of and system for dressing RF shield pads
US9180539B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2014 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Mar 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A radio-frequency (RF) shield pad is “dressed” by automatically removing melted solder from the shield pad by traversing a pattern of the shield pad. After an RF shield has been removed from a shield pad of a printed circuit board (PCB), the PCB is pre-heated to a temperature sufficient to heat solder on the shield pad and to prevent thermally stressing the PCB during the dressing process. The solder is melted, such as by a heated tip of a desoldering tool, and the melted solder is vacuumed while the tip automatically traverses the pattern of the shield pad, until all or a threshold amount of the melted solder has been removed from the shield pad. After the PCB has been reworked, solder paste is automatically disposed on the RF-shield pad, the RF shield is temporarily mounted on the RF-shield pad, and the PCB is processed in a reflow oven, thereby securely attaching the RF shield to the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.