Optical substrates having light collimating and diffusion structures
US9180609B2 · kind B2 · utility
0Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2014 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Aug 26, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133607
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention discloses a method of forming an uneven structure on a substrate. Cut a plurality of trenches in an order on a surface of a mold through a control system, wherein the plurality of trenches comprise at least one first trench, wherein for any second trench of the at least one first trench, the second trench overlaps with at least one third trench different from the second trench such that the second trench is cut off by the at least one third trench. Use the surface of the mold to emboss a thin film on the substrate to form the uneven structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.