Adhesive resin compositions, and laminates and flexible printed wiring boards using same
US9181464B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 18, 2010 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Jan 18, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.