Method of manufacturing a sensor for sensing analytes
US9182368B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Mar 17, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of manufacturing a sensor for sensing analytes, the method including: with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate; forming an insulating layer coupled to exposed surfaces of the substrate and exposed surfaces of the array of columnar protrusions; removing a portion of the insulating layer at a second surface of the substrate, directly opposed to the first surface of the substrate; with the dicing saw, removing material from a distal end of each columnar protrusion in the array of columnar protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each columnar protrusion in the array of columnar protrusions; and coupling a conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.