Microcircuit module of reduced size and smart card comprising same
US9183485B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2012 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Jun 8, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07733
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A microcircuit module for a smart card includes a generally rectangular carrier film (101) provided with eight contact pads on a first face thereof and with an electronic component on a second face, the electronic component being equipped with connection terminals to which the contact pads are connected via the carrier film. The eight contact pads are disposed in two parallel series of three contact pads (C1, C2, C3, C5, C6, C7), with two other contact pads (C′4, C′8) being disposed therebetween and each being positioned close to the contact pads from the ends of each of the series. The contact pads each measure at least 1.7 mm×2 mm. The contact pads of the two parallel series comply with ISO standard 7816 and the eight contact pads border each of the sides of the carrier film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.