Substrate processing apparatus
US9184073B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2013 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Jul 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus is disclosed. The substrate processing apparatus includes: a first process unit including a plurality of first process stations configured to perform a first process in a first atmosphere; a second process unit including a plurality of second process stations configured to perform a second process in a second atmosphere different from the first atmosphere; and a transformation unit between the first process unit and the second process unit. The first process unit, the transformation unit, and the second process unit are arranged in a line. The transformation unit includes a plurality of transformation stations configured to transform an atmosphere between the first atmosphere and the second atmosphere. Thus, the efficiency of processing a substrate can be improved, and the area or length in which the substrate processing apparatus is installed can be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.