Systems and methods for handling wafers
US9184079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2010 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Mar 19, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.