Apparatus, hybrid laminated body, method and materials for temporary substrate support
US9184083B2 · kind B2 · utility
1Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2013 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Jul 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31623
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a polyamide thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.