Devices having nanoscale structures and methods for making same
US9184308B1 · kind B1 · utility
3Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2013 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Sep 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/00
Abstract
In one embodiment, devices, such as metal-insulator-metal tunneling diodes, are fabricated by forming a cavity in a substrate having a top surface, conformally depositing a thin film of material in the cavity so as to form a thin layer of material on walls of the cavity, and depositing a layer of material to fill the cavity, wherein a top edge of the thin film is exposed and is flush with the top surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.