Thermal dissipation techniques for multi-sensory electromechanical products packaged in sealed enclosures
US9185822B2 · kind B2 · utility
7Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2012 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Nov 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In general, the disclosure is directed to sealed enclosures and devices that include enclosures for protecting enclosed heat sensitive components from the heat generated by enclosed heat producing components. Heat producing components within the enclosure may be placed to achieve uniform distribution of heat produced by the heat producing components, to optimize the dissipation of heat from the heat producing components to the enclosure, and to minimize the heat experienced by the heat sensitive components. The exterior of the enclosure may be designed to increase thermal dissipation and to protect against thermal radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.