Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam
US9187592B2 · kind B2 · utility
5Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2009 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Mar 5, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot-curing epoxy resin compositions are disclosed which firstly are solid in a hardened state at room temperature and secondly form an adhesion-free surface and are impact-resistant and can have high glass transition temperatures, above, for example, 110° C. An exemplary hot-curing epoxy resin composition can form separate phases on hardening, a continuous phase being formed by epoxy resins. If the compositions include a blowing agent, they can have excellent suitability for production of foams, such as structural foams.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.