Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same
US9187635B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Apr 22, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.