Release films via solventless extrusion processes
US9187678B2 · kind B2 · utility
14Cited by
15References
25Claims
0Family size
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Key dates
| Filing date | Jul 29, 2013 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Dec 24, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Described herein are release layers formed via solventless extrusion. The release layers include a polyolefin and an alkyl dimethicone. The release layers exhibit tailorable release properties from pressure-sensitive adhesives. The release layers are simple to make and require no post-treatment in order to impart the observed release properties. The release layers are adaptable to multilayer extrusion, blown film formation, and cast film formation techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.