Methods of resizing holes
US9187816B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2012 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Feb 12, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF23R2900/00019
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods of reducing an initial cross-sectional area of a hole in a component to a predetermined cross-sectional area including preparing a composition comprising at least an aluminum alloy with a melting temperature higher than aluminum, applying the composition to an interior surface of the hole, and then heating the component to cause a metal within the component to diffuse from the component into the composition and react with the aluminum alloy in the composition to form a coating on the interior surface of the hole. The heating step is performed to selectively modify the initial cross-sectional area of the hole and thereby directly attain the predetermined cross-sectional area thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.