Infrared cut filter and imaging apparatus
US9188720B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Apr 8, 2014 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Apr 8, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/223
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An infrared cut filter includes: a transparent dielectric substrate; an infrared reflecting layer formed on one surface of the transparent dielectric substrate and configured to reflect infrared light; and an infrared absorbing layer formed on the other surface of the transparent dielectric substrate and configured to absorb infrared light. The infrared absorbing layer is formed by encapsulating infrared absorbing pigment in a matrix containing silica, formed by a sol-gel method, as a main component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.