Patent · US Active

Optical-electrical connector having inproved heat sink

US9188752B2 · kind B2 · utility

5Cited by

7References

7Claims

0Family size

Assignee

FOXCONN INTERCONNECT TECHNOLOGY LIMITED · KY

Inventors

Wei Nong Chou · La Puente, US
JUN-BIN HUANG · Taoyuan, TW
GANG PAUL CHEN · Walnut, US
Jie Zheng · Walnut, US
Yuan-Chieh Lin · Hsinchu, TW
An-Jen Yang · Irvine, US
Jim Zhao · Fullerton, US
Qing-Man Zhu · Kunshan, CN
Shuai-Hui Huang · Kunshan, CN
LI-SHING HOU · New Taipei, TW

Key dates

Filing date	Nov 8, 2013
Grant date	Nov 17, 2015
Priority date	—
Expiry date	Feb 14, 2034

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/3807
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An optical-electrical connector (100) having an end for mating with an electrical connector and an opposite end coupling with an optical medium, includes a thermal conductive shell (10), a printed circuit board assembly (20) received in the thermal conductive shell, and an optical-electrical module (50). The printed circuit board assembly includes a printed circuit board (21) including a thermal conductive layer (214) thermal conductively connected with the metal shell. The optical-electrical module is mounted on the printed circuit board and is in contact with the thermal conductive layer, heat produced by the optical-electrical module being transmitted to the thermal conductive shell by the thermal conductive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.