Radiation-sensitive resin composition, method for forming resist pattern, acid generating agent and compound
US9188858B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 26, 2012 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Sep 26, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C2603/74
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A radiation-sensitive resin composition includes an acid generating agent to generate a compound represented by a following formula (1) by irradiation with a radioactive ray. In the formula (1), R1 represents a monovalent organic group having 1 to 20 carbon atoms. R2 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. The compound represented by the formula (1) is preferably a compound represented by a following formula (1-1). In the formula (1-1), R2 is as defined in the above formula (1). X represents an electron attractive group. R3 represents a monovalent organic group having 1 to 20 carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.