IC chip package disabling device
US9189656B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2014 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Nov 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY04S40/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A chip package comprises: an IC substrate, wherein the IC substrate comprises at least one electronic device; a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light; a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.