Patent · US Active

Preform including a groove extending to an edge of the preform

US9190384B2 · kind B2 · utility

0Cited by

6References

12Claims

0Family size

Assignee

TriQuint Semiconductor, Inc. · US

Inventors

Shixi Louis Liu · Milpitas, US
Wenlong Ma · Fremont, US
Frank Hin-Fai Chau · Fremont, US
Barry Jia-Fu Lin · Cupertino, US

Key dates

Filing date	Mar 20, 2014
Grant date	Nov 17, 2015
Priority date	—
Expiry date	Apr 20, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/10155
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments include but are not limited to apparatuses and systems including a die or a preform including at least one groove configured to extend from at least one via of the die to an edge of the die. Other embodiments may be described and claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.