Patent · US Active

LED module

US9190394B2 · kind B2 · utility

4Cited by

4References

19Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Frank Singer · Regenstauf, DE
Michael Zitzlsperger · Regensburg, DE
Stefan Groetsch · Bad Abbach, DE

Key dates

Filing date	Sep 21, 2012
Grant date	Nov 17, 2015
Priority date	—
Expiry date	Sep 21, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8582
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.