Passive waveguide components manufactured by three dimensional printing and injection molding techniques
US9190706B2 · kind B2 · utility
3Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2011 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Apr 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Various embodiments are directed toward low cost passive waveguide components. For example, various embodiments relate to passive waveguide components created busing a low cost fabrication technology. In some embodiments, a three-dimensional (3D) printing process is used to create a design mold and a non-conductive structure of the waveguide is formed using a plastic injection molding process. A conductive layer may be formed over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.