Method of manufacturing printed circuit board
US9192050B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2013 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Mar 3, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.