Methods and system for controlled laser-driven explosive bonding
US9192056B2 · kind B2 · utility
20Cited by
1References
23Claims
0Family size
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Key dates
| Filing date | Sep 12, 2011 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Jan 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1527
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A technique for bonding two dissimilar materials includes positioning a second material over a first material at an oblique angle and applying a tamping layer over the second martial. A laser beam is directed at the second material that generates a plasma at the location of impact on the second material. The plasma generates pressure that accelerates a portion of the second material to a very high velocity and towards the first material. The second material impacts the first material causing bonding of the two materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.