Power electronic module cooling system and method
US9192079B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 26, 2008 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | Apr 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided that includes an air passageway configured to allow cooling air to bypass a portion of a heatsink adjacent to the rectifier circuitry and direct cooling air into an area of the heatsink that is nearer to the inverter circuitry. Another embodiment employs an air passageway with an air directing structure configured to provide an air flow that impinges on a lateral surface of the heatsink. In another embodiment, the air directing structure is chosen to provide a turbulent air flow in the heat dissipating structure within the vicinity of the inverter circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.