Supplying system of adding gas into polishing slurry and method thereof
US9193032B2 · kind B2 · utility
2Cited by
25References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2014 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Apr 13, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A supplying system of adding gas into the polishing slurry and method thereof are described. The supplying system includes a slurry container, a gas-mixed container, an adjusting device, a first flow controller, and a second flow controller. The supplying system utilizes the adjusting device to mix the polishing slurry with gas for forming the gas-mixed polishing slurry. The supplying system of adding the gas into the polishing slurry and method thereof are capable of increasing the material removal rate of the surface of the substrate in order to improve the processing quality of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.