MEMS microphone package structure having an improved carrier and a method of manufacturing same
US9193581B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2014 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Jul 31, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2410/03
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An MEMS microphone package structure includes a substrate, a carrier and an acoustic transducer. The carrier covers the substrate from above and connects to the substrate. The carrier has an n-shaped cross section and includes a flat plate portion, a sidewall connected to the flat plate portion, and two oblique blocks protruded from the inner surface of the sidewall. The oblique blocks each have an inclined surface for connecting the flat plate portion and the bottom surface of the sidewall. The acoustic transducer is posited on the bottom surface of the flat plate portion and electrically connected to the substrate through a plurality of electrical conduction paths passing through the inclined surfaces. The electrical conduction paths are conducive to simplification of wirings of the substrate and the thinning of the substrate. Therefore, simplify the manufacturing process to reduce the manufacturing time and cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.