Thermoset resin composition and its use
US9193858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Jan 11, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.