Method of fabricating a plurality of metallic microstructures
US9194052B2 · kind B2 · utility
1Cited by
4References
22Claims
0Family size
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Key dates
| Filing date | May 26, 2010 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Apr 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of fabricating a plurality of metallic microstructures by LIGA process, the method including a flattening step or a levelling step of the resin layer before the step of electroforming the metallic microstructures permitting the resin layer to have a uniform thickness, which enables molds, and then finished metallic microstructures, to be made with uniform dimensional precision in the plane for the metallic microstructures of the same substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.