Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same
US9194887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2013 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Nov 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; wherein each probe is capable of elastic deformation when the probe tip comes in contact with the electronic devices; each probe comprising a plurality of isolated electrical vertical interconnect accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.