Method for manufacturing a card based on a substrate
US9195930B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2011 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Sep 23, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a card (102) based on a substrate (101), the method comprising a step of defining the perimeter of the card (102) within the substrate (101), the method also comprising a step of chamfering on a portion of the perimeter of the card (102) so that on completion of the perimeter definition and chamfering steps the physical dimensions of the card (102) are compliant with the parameters A, Ai, B, Bj, C2, C3, and Rm defined by that Micro SD card standard designated V3.00, wherein: i=1, 6 . . . 8; j=1, 4, 10, 11, x, y (the pair [x,y] being equal to [6,9] or to [14,15]); and m=1 . . . 6, 17 . . . 19, the physical dimensions of the card (102) also being compliant with the parameter A9 of the standard when x=6 and y=9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.