Electronic component assembly comprising a varistor and a semiconductor component
US9196402B2 · kind B2 · utility
3Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2009 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Mar 15, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electric component assembly comprising a semiconductor component (1) and a carrier is specified, wherein the carrier contains a highly thermally conductive ceramic and is connected to a varistor body. Heat from the semiconductor component can be at least partially dissipated to the carrier (3) by means of the varistor body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.