Multilayer ceramic electronic component
US9196421B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Oct 2, 2014 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Oct 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.