Polymer/inorganic multi-layer encapsulation film
US9196849B2 · kind B2 · utility
5Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2014 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Jan 31, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
Abstract
This invention relates to a polymer/inorganic multi-layer encapsulation film, and more particularly, to a multi-layer encapsulation film, which includes a plasma polymer thin film layer formed using a cross-shaped precursor having Si—O bonding and an inorganic thin film layer, and ensures flexibility and has improved encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.