Molding method of printed circuit board assembly
US9197026B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2011 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Aug 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.