Circuit board and electronic assembly
US9198286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2014 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Aug 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board including a first patterned conductive layer and a second patterned conductive layer isolated from the first patterned conductive layer is provided. The first patterned conductive layer has first signal traces and first ground traces. The second patterned conductive layer has second signal traces and second ground traces. An orthogonal projection of the second ground trace on the first patterned conductive layer partially overlaps at least one of the first signal traces. An orthogonal projection of the first ground trace on the second patterned conductive layer partially overlaps at least one of the second signal traces. An electronic assembly including the afore-described circuit board and a chip package connected thereto is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.