Printed circuit comprising at least one ceramic component
US9198295B2 · kind B2 · utility
5Cited by
10References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2011 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Oct 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A printed circuit includes a substrate onto which at least one ceramic component is attached so as to enable the heat produced by the ceramic component to be discharged and to prevent cracks in the ceramic component and in the substrate. To this end, the ceramic component is attached onto the substrate using two connectors made of metal matrix composite material. The two connectors further have incisions so as to enable the mechanical stresses exerted in the substrate to be carried over into the connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.