Method for manufacturing rigid-flexible printed circuit board
US9198304B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Apr 9, 2012 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Sep 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a rigid-flexible printed circuit board includes following steps. First, a flexible PCB is provided. The flexible PCB includes a base and an electrical trace layer on the base. The flexible PCB includes a first region and a second region connected to the first region. The first and second regions define a borderline. Second, a protective film and a peelable layer are sequentially formed on the electrical trace layer in the first region and part of the second region. Third, a copper coil, an adhesive tape and the flexible circuit board are laminated together. Fourth, the copper coil in the second region is etched to form an outer electrical trace layer. Last, the copper coil in the first region is removed and the peelable layer and the adhesive tape are peeled off, thereby obtaining an R-F PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.