Thermal separation of electronic control chassis heatsink fins
US9198328B1 · kind B1 · utility
6Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2012 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Aug 16, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20518
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics chassis for containing and supporting electronic components having different operating temperatures includes a plurality of thermally conductive walls forming an enclosure. There is a first heat dissipator in at least one of the walls having an external heat dissipator and a second heat dissipator in at least one of the walls having an external heat dissipator. There is a thermal isolator positioned in at least one of the walls to provide thermal isolation between the heat dissipators, and the thermal isolator includes a thermally insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.